DissolvPCB: Fully Recyclable 3D-Printed Electronics with Liquid Metal Conductors and PVA Substrates
July 29, 2025 Β· Declared Dead Β· π ACM Symposium on User Interface Software and Technology
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Authors
Zeyu Yan, SuHwan Hong, Josiah Hester, Tingyu Cheng, Huaishu Peng
arXiv ID
2507.22193
Category
cs.HC: Human-Computer Interaction
Citations
5
Venue
ACM Symposium on User Interface Software and Technology
Last Checked
4 months ago
Abstract
We introduce DissolvPCB, an electronic prototyping technique for fabricating fully recyclable printed circuit board assemblies (PCBAs) using affordable FDM 3D printing, with polyvinyl alcohol (PVA) as a water-soluble substrate and eutectic gallium-indium (EGaIn) as the conductive material. When obsolete, the PCBA can be easily recycled by immersing it in water: the PVA dissolves, the EGaIn re-forms into a liquid metal bead, and the electronic components are recovered. These materials can then be reused to fabricate a new PCBA. We present the DissolvPCB workflow, characterize its design parameters, evaluate the performance of circuits produced with it, and quantify its environmental impact through a lifecycle assessment (LCA) comparing it to conventional CNC-milled FR-4 boards. We further develop a software plugin that automatically converts PCB design files into 3D-printable circuit substrate models. To demonstrate the capabilities of DissolvPCB, we fabricate and recycle three functional prototypes: a Bluetooth speaker featuring a double-sided PCB, a finger fidget toy with a 3D circuit topology, and a shape-changing gripper enabled by Joule-heat-driven 4D printing. The paper concludes with a discussion of current technical limitations and opportunities for future directions.
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